The Intelligent Thermal Fabric Driving AI
Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling data centers in the present to unthrottled opportunities for the future.
Learn more about the Thermal Kit that is underpinning it all.
Reduce throttling.
Uplevel compute performance.
Deliver 3X ROI over 5 Years.
The moment is now for precise, millisecond response cooling for chip-level hotspots across the data center. From GPUs and xPUs, to rack and infrastructure including CDUs, switch ASICs and DIMMs, Phononic’s solutions are readily deployable, seamlessly scalable and consistently deliver real performance improvements.
ROI IN MONTHS
Reduce operational cost, enhance reliability and lifespan of hardware
Proven Performance
Less risk of throttling, even under high loads
MILLISECOND COOLING RESPONSE
Software enabled, real-time response vs. mechanical cooling
Extend Useful Life of Assets
Up to 5X life extension through throttling avoidance
Energy Efficient
Significantly reduce energy usage for cooling
DC THOUGHT STACK
The latest thinking on data center challenges and opportunities
Unleashing AI Performance: Why Cooling is Now as Critical as Compute
The Hot News Heard Around the Chillers: Optimizing Your AI Cooling Investments
Ushering In a New Era of AI Data Center Performance
Thermal Kit: Cooling to Unthrottle AI Performance
Delivering Advanced Cooling Solutions for Pioneers like CERN Pushing the Limits of Science
Accelerating the Future of AI
Responsive CDUs for AI Factory Energy Efficiency
Improve performance; up to 60% gains in TDP with constant TCase versus industry standard.
Increase TDP While Maintaining Today’s Thermal Management Architecture
Innovative Approaches to Data Center Cooling for AI, Edge, and High-Performance Computing
Phononic’s CPO Talks Solid State Cooling on Global Podcast
The Future of Data Center Cooling: Insights from NVIDIA GTC 2025
Lightwave Exclusive: Interview with Phononic at OFC 2025
Experience the Future of Cooling at OFC 2025
The Future Belongs to the Cooled
SOLID STATE TECHNOLOGY
The Power of Solid State, Unleashed with Phononic's Innovative Design
Our solid state technology is redefining cooling.
Phononic’s precise, predictive and performance-enhancing cooling approach is redefining how we address the world’s toughest thermal challenges.
With hundreds of radically innovative IP patents across thermal management, design and system controls, Phononic is the leader in cooling innovation.
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Contact Us to Unleash Your AI Performance
Transforming Data Center Cooling With Solid State Design
Phononic’s Thermal Kit transforms cooling into a performance-critical, intelligent platform. The company is the global leader in solid state cooling, and its thermoelectric designs, IP portfolio, devices and reference design kits are the underpinning of the company’s thermal management fabric of AI infrastructure.