Phononic in Telecommunications
Phononic enables high-performance thermoelectric cooling that delivers what the telecom industry needs: high reliability and heat pumping density paired with significantly lower power consumption. Our solutions enable better cooling performance for high and low data rate transfer as well as long reaches.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
ReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.
Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
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Addressing Reliability in LiDAR Systems with Thermoelectric Cooling
LiDAR technology is useful for autonomous vehicles to create a virtual map of the area around a vehicle to measure velocity and provide data communication.
Top Takeaways from CIOE 2019
After attending CIOE 2019, an event focused on advancing state-of-the-art optical communications, our team shares its major notes and takeaways.
Cooled Optics in NG-PON2 Deployment
Next-Generation Passive Optical Network 2 (NG-PON2) is a network standard capable of delivering throughput of up to 40Gbit/s across the network.
Addressing Reliability in a Non-Hermetic Laser Package
Cooled non-hermetic laser packages are one way of cutting costs while meeting the performance requirements of those demands.