Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Reliable, High Performance Laser Packages

March 8, 2018
March 08, 2018 – 

Phononic unveiled its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform, designed to provide high reliability and cooling performance, along with lower power consumption, for laser packaging. This advancement is a solid-state, precision-cooling solution for sub-components within telecommunication and data center applications.

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Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Telecom and Datacom Laser Packages
Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Telecom and Datacom Laser Packages

Phononic has unveiled new proprietary thermoelectric cooler platform for laser packages within telecom and ...

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