Fully optimized, in every way possible.
Our TECs for optical communication components are superior from end to end—in power consumption, performance vs. size, reliability, and quality. We custom-design our TECs to be optimized for any application and any need.
We know and solve your challenges.
With greater need to increase efficiency, power consumption is more critical than ever. Our solid-state technology delivers up to 30% lower power in your application.
More heat in less space
Increasing heat density within shrinking form factors is challenging. Our TECs deliver greater heat pumping in a smaller footprint.
Today’s manufacturers seek non-hermetic alternatives for cooled laser packages, but many of these solutions will likely fall short in harsh environments and critical applications. Our ReefTEC ™ platform has been tested and proven to enable lower power consumption and help significantly reduce TOSA cost.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.Learn more
ReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.Learn more
Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.Learn more
Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and Photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.Learn more
Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:
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Internet of Things (IoT)
The Internet of Things (IoT) refers to a broad incorporation of digital and computing devices. Read more about IoT and the need for cooling systems.
Solid-State Technology and It’s Applications
Solid state refers to technology that uses semiconductors to replace mechanical parts. Phononic has been an innovator of solid state technology to deliver a better and more sustainable cooling.
What is Thermal Design and How is it Used?
Thermal Design is a division of engineering that uses thermodynamics to design technology and products. Learn more about how Phononic uses thermal design!
Data communication (datacom) is the transfer of data using channels like optical fibers. You must manage heat in datacom. Learn more about datacom cooling.