Box TOSA TECs
Phononic supports the cooling of box TOSA (transmit optical subassembly) laser packages with low-power consumption, high-performance TECs. This series is perfect for 100G and higher applications, QSFP transceiver packages, and the long-reach requirements (LR4/10km and beyond) that are in demand from the growth of optical components used in data centers.
Discover performance at scale for high-volume production, including an industry-leading, cost-saving non-hermetic TEC platform.
Learn about solutions that offer leading performance, significant reductions in power consumption, and high reliability.
TECs open the door to new functionality and improved sensitivity in LiDAR applications where sensor performance is mission-critical to safety.
Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:
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Internet of Things (IoT)
The Internet of Things (IoT) refers to a broad incorporation of digital and computing devices. Read more about IoT and the need for cooling systems.
Solid-State Technology and It’s Applications
Solid state refers to technology that uses semiconductors to replace mechanical parts. Phononic has been an innovator of solid state technology to deliver a better and more sustainable cooling.
What is Thermal Design and How is it Used?
Thermal Design is a division of engineering that uses thermodynamics to design technology and products. Learn more about how Phononic uses thermal design!
Data communication (datacom) is the transfer of data using channels like optical fibers. You must manage heat in datacom. Learn more about datacom cooling.