ReefTEC™ Non-Hermetic TEC Platform
Phononic’s non-hermetic compatible TEC platform is fundamentally re-engineered to provide telecom-grade reliability and unparalleled cooling performance for non-hermetic laser packaging. Our platform addresses the root cause of TEC failure in highly accelerated condensing environments and improve reliability by 5X over hermetic TECs or alternative non-hermetic solutions.
High-speed data transmission needs in datacenters are more likely than ever to require cooled lasers to meet performance requirements. ReefTEC enables packaging that significantly reduces TOSA cost.
Learn about solutions that offer leading performance, significant reductions in power consumption, and high reliability.
TECs open the door to new functionality and improved sensitivity in LiDAR applications where sensor performance is mission-critical to safety.
Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:
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Contact us to start an application-specific ReefTEC(TM) design for your non-hermetic laser package.
Internet of Things (IoT)
The Internet of Things (IoT) refers to a broad incorporation of digital and computing devices. Read more about IoT and the need for cooling systems.
Solid-State Technology and It’s Applications
Solid state refers to technology that uses semiconductors to replace mechanical parts. Phononic has been an innovator of solid state technology to deliver a better and more sustainable cooling.
What is Thermal Design and How is it Used?
Thermal Design is a division of engineering that uses thermodynamics to design technology and products. Learn more about how Phononic uses thermal design!
Data communication (datacom) is the transfer of data using channels like optical fibers. You must manage heat in datacom. Learn more about datacom cooling.